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Targeting at a comprehensive Multiphysics evaluation for Al wire and ribbon bonding technologies for WBGpower module, this paper investigates and compares the stray inductance, heat dissipation and fatigue lifebetween these two bonding schemes in an XHP packaging designed in house. During calculation, it was triedto keep equivalent volume for the Al ribbon when substituting local Al wires for fair comparison. Results ofstray inductance show extremely limit bonding-type dependence in ranges from 1 kHz to 10 MHz, and furtherexpanding ribbon size to varied levels still presents negligible impact. The two bonding technologies do notprove their capability in sharing either static or transient thermal loads when the baseplate bottom isefficiently liquid cooled. Detailed study confirms that heat dissipates dominantly in vertical direction to theCu baseplate rather than through Al bonds. Ultimately, the only noticeable benefit of Al ribbon in ourmultiscale analysis is its improved reliability during temperature cycling, with data supporting a 2.17× timeslonger lifetime of Al ribbon when comparing to its Al wire counterpart.

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