A new GDMS procedure was developed and successfully applied for the anal. of critical trace elements in metallic, semiconductor and dielec. thin films of 100 - 500 nm thickness.This procedure allows for characterization of both the averaged trace elemental concentration in the analyzed layer and elemental depth profile with sufficient resolution, of 10 - 50 nm.Examples of anal. include (Cu, Pt)/Si, GaN/Al2O3, AlGaAs/GaAs, InGaAs/GaAs and dielec. films on metal and non-conductive substrates.The newly developed anal. method might be considered as a substitution of SIMS for several materials, like nitride semiconductors, dielec. thin films and large area metallic films on non-conductive substrates.